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Toshiba’s leading Cambridge Research Laboratory (CRL) doubles down on cutting edge embodied AI to bring AI into the real world.

Cambridge, United Kingdom – 17th June 2024

Toshiba’s Cambridge Research Laboratory (CRL) is excited to announce its acceleration of cutting-edge research into Embodied AI, a technology that combines physical presence with cooperative intelligence. This move reflects CRL’s commitment to advancing innovative research in the field of sustainable and human-centric AI. Our latest results are presented in two papers at the high-impact computer science conference, CVPR (Conference on Computer Vision and Pattern Recognition).
In today’s rapidly evolving landscape, AI is becoming the cornerstone of technological innovation. In this new world, conversational agents and virtual assistants have become common place, however, AI still hasn’t been effectively brought into physical domains, or to every industry; Fields such as logistics, maintenance and manufacturing cannot be fully addressed in cyberspace or using software alone. For example, Embodied AI plays an important role in reshaping the retail industry which has interaction in dynamic environments with ever-changing product offerings and customer demands.
CRL is at the forefront of research into Embodied AI, fueled by a £15 million investment from Toshiba in the next five years into the field. In line with this vision, Toshiba is excited to announce that CRL’s innovative core technologies are going to enhance Toshiba’s existing AI catalogue very soon. Our first industrial prototype of Embodied AI is planned for presentation in 2027, bringing us closer to a new era of intelligent collaboration between humans and machines.

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About Toshiba

As Toshiba Group celebrates its 150th anniversary in 2025, it is enhancing its management structure, streamlining operations, and investing in forward-looking businesses to build foundations for new growth. This will allow it to continue to support advances toward a sustainable future with products and services developed by its wide range of businesses in the energy, infrastructure, and electronic devices domains.

Guided by its corporate philosophy, “Committed to People, Committed to the Future,” Toshiba brings industry-leading capabilities in green transformation (GX) and digital transformation (DX) to solutions for companies addressing the many challenges faced by modern society. By leveraging the power of data derived from its constantly evolving products and solutions, the Group is determined to help to achieve carbon neutrality and a circular economy. In fiscal year 2023, Toshiba Group generated annual sales of 3.3 trillion yen, and had 105,000 employees around the world.

Latest Publications

Information contained in news and other announcements is current on the date of posting, but subject to change without notice.

Quantum Information Group
2025

Toshiba’s leading Cambridge Research Laboratory (CRL) doubles down on cutting edge embodied AI to bring AI into the real world.

Cambridge, United Kingdom – 17th June 2024

2024

Davide G. Marangon, Peter R. Smith, Nathan Walk, Taofiq K. Paraïso, James F. Dynes, Victor Lovic, Mirko Sanzaro, Thomas Roger, Innocenzo De Marco, Marco Lucamarini, Zhiliang Yuan & Andrew J. Shields

2023

P. Gavignet ORA, F. Mondain ORA, E. Pincemin ORA, A. J. Grant T, L. Johnson T, R. I. Woodward T, J. F. Dynes T, and A. J. Shields T
Optical Fiber Communication Conference (OFC) 2023, Technical Digest Series
(Optica Publishing Group, 2023), paper Tu3H.2 (19 May 2023)

arXiv:2305.13742

2023

Wavelength-versatile quantum key distribution for reconfigurable classical-quantum networks

R. I. Woodward T, B. Griffiths T, Y. S. Lo T, J. F. Dynes T and A. J. Shields
OFC (Optical Fibre Communications) Conference (24-28 March 2024)

2023

A.Barbiero T, G. Shooter T, T. Müller T, J.Skiba-Szymanska T, R.M. Stevenson T, L. E. Goff CAV, D. A. Ritchie CAV and A. J. Shields T
Nano Letters (edited by ACS Publications)

2023

J. A. Dolphin T, ENG, T. K. Paraiso T, H. Du T, and A. J. Shields T
CLEO 2023, Technical Digest Series (Optica Publishing Group, 2023), paper AM3N.4 (7 May 2023)

2023

T. Roger T, R. Singh T, C. Perumangatt T , D. G. Marangon T, P. R. Smith T , M. Sanzaro T, R. I. Woodward T, and A. J. Shields T
Science Advances Vol. 9,Issue 48 (1 December 2023).

2023

S. Donadello, C. Clivati, A. Meda, S. Virzì, M. Genovese, F. Levi, A. Mura, M. Pittaluga, Z. Yuan, A. J. Shields, M. Lucamarini, I. P. Degiovanni, and D. Calonico,
Quantum 2.0 Conference and Exhibition, Technical Digest Series (Optica Publishing Group, 2022), paper QTu4C.3. (13-16 June 2022)

2023

R. Singh T, C. Perumangatt T, T. Roger T and A. J. Shields T
CLEO 2023, Technical Digest Series (Optica Publishing Group, 2023), paper JW2A.100 (7 May 2023)

2023

Hybrid Photonic Integrated QKD Transceiver Chip

T Paraiso T
Toshiba Review Highlight 2023

Vision & Learning Group
2023

S Morad, R Kortvelesy, S Liwicki, A Prorok,
NeurIPS 2023

2023

C Zhang, S Liwicki, S He, W Smith, R Cipolla,
In TPAMI

2023

S Morad, R Kortvelesy, M Bettini, S Liwicki, A Prorok
ICLR May 2023

2022

P Somaiya, H Pandya, R Polvara, M Hanheide, G Cielniak
NeurIPS Workshop, December 2022

2022

R. P. K. Poudel, H. Pandya, R. Cipolla
NeurIPS Workshop, December 2022 / arXiv

2022

A. Paren, R. P. K. Poudel
BMVC, November 2022

2022

C. Zhang, S. Liwicki, R. Cipolla
BMVC, November 2022

2022

F. Logothetis, R. Mecca, I. Budvytis, R. Cipolla
International Journal of Computer Vision / arXiv

2022

A. Paren, R. P. K. Poudel, M. Pawan Kumar
Transactions of Machine Learning Research

2022

H. Sankhla, M. Qureshi, S. Narayanan, V. Mittal, G. Gupta, H. Pandya, KM. Krishna
CASE, August 2022 / arXiv

2022

S. Morad, S. Liwicki, R. Kortvelesy, R. Mecca, A. Prorok
L4DC, June 2022 / arXiv

Language & Interaction Group
2024

Rudra P.K. Poudel, Harit Pandya, Stephan Liwick, Roberto Cipolla
Cambridge Research Laboratory Toshiba Europe Ltd, UK

2024

Chao Zhang, Mohan Li, Ignas Budvytis, Stephan Liwicki
Toshiba Europe Ltd

2023

Cumulative Attention based streaming transformer ASR with internal language model joint training and rescoring

M. Li, C-T Do and R. Doddipatla
Accepted at the 2023 International Conference on Acoustics, Speech, and Signal Processing (ICASSP 2023), Rhodes Island, Greece, June 2023

2023

Frame-wise and overlap-robust speaker embeddings for meeting diarization

T. Cord-Landwehr, C. Boeddeker, T-C Zorilă, R. Doddipatla and R. Haeb-Umbach
Accepted at the 2023 International Conference on Acoustics, Speech, and Signal Processing (ICASSP 2023), Rhodes Island, Greece, June 2023

2023

On the effectiveness of monoaural target source extraction for distant end-to-end automatic speech recognition

T-C Zorilă and R. Doddipatla
Accepted at the 2023 International Conference on Acoustics, Speech, and Signal Processing (ICASSP 2023), Rhodes Island, Greece, June 2023

2023

M Li and R. Doddipatla
Proc. IEEE Spoken Language Technology Workshop (SLT 2022), Doha, Qatar, January 2023

2022

C-T Do, M. Li and R. Doddipatla
Proc. Interspeech 2022, Incheon, Korea, September 2022 / arXiv

2022

M. Li, R. Doddipatla and T-C Zorilă
Proc. Interspeech 2022, Incheon, Korea, September 2022

2022

S. Stoyanchev, S. Pandey, S. Keizer, N. Braunschweiler and R. Doddipatla
Proc. 23rd Annual Meeting of the Special Interest Group on Discourse and Dialogue (SIGDIAL 2022), Edinburgh, UK, September 2022

2022

J. Zhang, T-C Zorila, R. Doddipatla and J. Barker
Proc. Interspeech 2022, Incheon, Korea, September 2022

2022

Comparing human emotion perception and automatic emotion recognition of user turns in human-machine dialogues

N. Braunschweiler, R. Doddipatla, S. Keizer, and S. Stoyanchev
Proc. UK Speech 2022, Edinburgh, UK, September 2022

2022

Y. Farag, C. O. Brand, J. Amidei, P. Piwek, T. Stafford, S. Stoyanchev and A. Vlachos
Findings of the Association for Computational Linguistics: EMNLP 2022, Abu Dhabi, December 2022

2022

T. Cord-Landwehr, C. Boeddeker, T. von Neumann, T-C Zorilă, R. Doddipatla and R. Haeb-Umbach
Proc. 2022 International Workshop on Acoustic Signal Enhancement (IWAENC), Bamberg, Germany

2022

M. Li, S. Zhang, T.C. Zorila, and R. Doddipatla
Proc. IEEE ICASSP 2022, Singapore

2022

N. Braunschweiler, R. Doddipatla, S. Keizer, and S. Stoyanchev
IEEE Signal Processing Letters

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